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FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862

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FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000pc/Month

Delivery Time : 4 Weeks

Packaging Details : PCB + Box

Brand Name : CUSTOM MADE

Certification : ISO/UL

Keyword : Prototype PCB Assembly

Materials : High-Tg FR4, RCC, PTFE, TU862, TU872

Min Width/Space : 2.4/2.4mil

Surface Finished : Immersion Gold+OSP, HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp

Bow & Twist : ≤0.5%

Applications : Automotive Electronics, Communications

PCB Board : multilayer boards, Metal base boards

Features : High Reliability, Designability, Producibility

Payment Method : T/T

Whether to Support customization : Support

Logistics : Accept customer specified logistics

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FPC Boards Prototype PCB Assembly Carbon Ink Through Hole Assembly TU862

Prototype PCB Assembly Description:

1. From prototype to production.

2. 2-68 layers board fabrication.

3. TPS Lean production and high reliability.

4. IATF16949, UL certification.

Prototype PCB Assembly Parameters:

SMT Capability 14 million spots per day
SMT Lines 12 SMT lines
Reject Rate R&C: 0.3%
IC: 0%
PCB Board POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards
Parts Dimension Min BGA Footprint:03015 Chip/0.35mm BGA
Parts SMT Accuracy:±0.04mm
IC SMT Accuracy:±0.03mm
PCB Dimension Size:50*50mm-686*508mm
Thickness: 0.3-6.5mm


Prototype PCB Assembly Introduction:

1. After the electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors are avoided, and automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, which ensures electronic products. quality, improve labor productivity, reduce costs, and facilitate maintenance.
2. Provide the required electrical characteristics, characteristic impedance, and electromagnetic compatibility characteristics for the circuit in high-speed or high-frequency circuits.
3. The printed board with passive components embedded inside provides certain electrical functions, simplifies the electronic installation procedure, and improves the reliability of the product.
4. In large-scale and ultra-large-scale electronic packaging components, an effective chip carrier is provided for the miniaturized chip packaging of electronic components.

FPC Prototype Pcb Manufacturing Through Hole Multilayer Board Assembly TU862


Product Tags:

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